Applied Materials, Inc. (AMAT)
- GlobeNewswire
Applied Materials Introduces New Technologies and Capabilities for Accelerating the Semiconductor Industry’s Heterogeneous Integration Roadmap
Accelerating Heterogeneous Design and Integration Heterogeneous integration brings new kinds of design and manufacturing flexibility to semiconductor and systems companies by allowing chips of various technologies, functions and sizes to be integrated in one package. Applied Materials is combining its leadership in process technology and large-area substrates along with ecosystem collaborations to accelerate the industry’s heterogeneous design and integration roadmaps. New advanced software mode
- GlobeNewswire
New Applied Materials Technologies Help Leading Silicon Carbide Chipmakers Accelerate the Transition to 200mm Wafers and Increase Chip Performance and Power Efficiency
Applied Materials’ silicon carbide-optimized Mirra® Durum™ CMP System To help enable the silicon carbide chip industry’s move to larger, 200mm wafers, Applied Materials introduced the Mirra® Durum™ CMP system. It produces uniform SiC wafers with the highest quality surfaces by integrating polishing, materials removal measurement, cleaning and drying in a single system. Applied Materials’ silicon carbide-optimized VIISta® 900 3D Hot Ion Implant System Applied Materials’ new VIISta® 900 3D hot ion
- GlobeNewswire
Applied Materials Announces Cash Dividend
SANTA CLARA, Calif., Sept. 02, 2021 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that its Board of Directors has approved a quarterly cash dividend of $0.24 per share payable on the company’s common stock. The dividend is payable on Dec. 16, 2021 to shareholders of record as of Nov. 26, 2021. The quarterly cash dividend is a key component of Applied’s capital allocation strategy. In the third quarter of fiscal 2021, Applied returned $1.72 billion, or 111 percent of free cash flow,
