13-11 Omori-Kita 2-chome
Ota-ku
Tokyo 143-8580
Japan
81 3 4590 1111
https://www.disco.co.jp
Settore/i: Technology
Settore: Semiconductor Equipment & Materials
Impiegati a tempo pieno:
Nome | Titolo | Retribuzione | Esercitate | Anno di nascita |
---|---|---|---|---|
Mr. Kazuma Sekiya | Representative Executive Officer, President, GM of Engineering R&D Division and Director | 266M | N/D | 1966 |
Mr. Takao Tamura | Managing Exec Ofcr., CFO, Chief Env. & Privacy Officer, GM of Corp. Support Div. and Director | 90M | N/D | 1955 |
Mr. Noboru Yoshinaga | Executive VP, Representative Executive Officer, GM of Sales Division & Director | 133M | N/D | 1957 |
Naoki Abe | Managing Executive Officer & GM of Manufacturing Division | N/D | N/D | N/D |
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws. The company also offers precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products. In addition, it is involved in the maintenance, disassembly, and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its machines. Further, the company leases precision machines; and purchases and sells used machines. Additionally, it manufactures and sells precision diamond abrasive tools, as well as offers chargeable processing services. The company was founded in 1937 and is headquartered in Tokyo, Japan.
L'ISS Governance QualityScore di Disco Corporation al 1 maggio 2024 è 2. I criteri di valutazione fondamentali sono revisione: 1; Consiglio di Amministrazione: 1; diritti degli azionisti: 9; retribuzione: 1.