Amkor Technology, Inc. (AMKR)

32,34 +0,68 (+2,15%) Alla chiusura: 04:00PM EDT

Amkor Technology, Inc.

2045 East Innovation Circle
Tempe, AZ 85284
United States
480 821 5000
https://amkor.com

Settore/i: Technology
Settore: Semiconductor Equipment & Materials
Impiegati a tempo pieno: 28.700

Figure dirigenziali chiave

Nome	Titolo	Retribuzione	Esercitate	Anno di nascita
Mr. James J. Kim	Executive Chairman of the Board	1,92M	N/D	1936
Mr. Giel Rutten	President, CEO & Director	2,01M	830,9k	1957
Ms. Susan Y. Kim	Executive Vice Chairman	224,01k	N/D	1963
Ms. Megan Faust	Executive VP, CFO & Treasurer	943,78k	794,99k	1974
Mr. Mark N. Rogers	Executive VP, General Counsel & Corporate Secretary	863,88k	N/D	1966
Mr. Farshad Haghighi	Executive VP & Chief Sales Officer	1,63M	108,83k	1963
Mr. Kevin Engel	Executive Vice President of Business Units	717,28k	98,73k	1972
Ms. Jennifer Jue	Vice President of Investor Relations & Finance	N/D	N/D	N/D
JinAn Lee	Executive Vice President of Worldwide Manufacturing	N/D	N/D	N/D

Gli importi risalgono al giorno 31 dicembre 2023 e i valori di compensazione riguardano l'anno fiscale che si chiude a tale data. La retribuzione include salari, bonus ecc. "Esercitate" è il valore delle opzioni esercitate durante l'anno fiscale. Valuta in USD.

Descrizione

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.

Governance aziendale

L'ISS Governance QualityScore di Amkor Technology, Inc. al 1 maggio 2024 è 5. I criteri di valutazione fondamentali sono revisione: 4; Consiglio di Amministrazione: 7; diritti degli azionisti: 5; retribuzione: 5.

Punteggi di corporate governance forniti da Institutional Shareholder Services (ISS). I punteggi indicano il rango decile relativo all’indice o alla regione. Un punteggio di decile pari a 1 indica un governance risk più basso, mentre un punteggio di 10 indica un governance risk più alto.