BE Semiconductor Industries N.V. (BESI.AS)

132,65 +1,05 (+0,80%) Alla chiusura: 05:36PM CEST

BE Semiconductor Industries N.V.

Ratio 6
Duiven 6921 RW
Netherlands
31 26 319 4500
https://www.besi.com

Settore/i: Technology
Settore: Semiconductor Equipment & Materials
Impiegati a tempo pieno: 1.760

Figure dirigenziali chiave

Nome	Titolo	Retribuzione	Esercitate	Anno di nascita
Mr. Richard W. Blickman	Chairman of Management Board, President & CEO	1,88M	N/D	1954
Mr. Leon Verweijen	Senior Vice President of Finance	N/D	N/D	1976
Mr. Henk-Jan Jonge Poerink	Senior Vice President of Global Operations	N/D	N/D	1970
Edmond Franco	Vice President of Corporate Development	N/D	N/D	N/D
Mr. Rene W. Hendriks	Senior Vice President of Sales - North America & Europe	N/D	N/D	1961
Mr. Peter Wiedner	Senior Vice President of Sub Micron Die Attach	N/D	N/D	1970
Mr. Jong Kwon Park	Senior Vice President of Sales & Customer Support - APAC	N/D	N/D	1966
Mr. Jeroen Kleijburg	Senior Vice President of Packaging	N/D	N/D	1974
Mr. Christoph Scheiring	Senior Vice President of Die Attach	N/D	N/D	1970
Andrea Kopp-Battaglia	Senior Vice President of Finance- Die Attach	N/D	N/D	1978

Gli importi risalgono al giorno 31 dicembre 2023 e i valori di compensazione riguardano l'anno fiscale che si chiude a tale data. La retribuzione include salari, bonus ecc. "Esercitate" è il valore delle opzioni esercitate durante l'anno fiscale. Valuta in EUR.

Descrizione

BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Governance aziendale

L'ISS Governance QualityScore di BE Semiconductor Industries N.V. al 1 maggio 2024 è 2. I criteri di valutazione fondamentali sono revisione: 6; Consiglio di Amministrazione: 1; diritti degli azionisti: 5; retribuzione: 2.

Punteggi di corporate governance forniti da Institutional Shareholder Services (ISS). I punteggi indicano il rango decile relativo all’indice o alla regione. Un punteggio di decile pari a 1 indica un governance risk più basso, mentre un punteggio di 10 indica un governance risk più alto.